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Online Trade Fair Details
| Title |
2024 Microelectronics Show |
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|---|---|---|---|---|
You can sign up and unlock it for freeAccess to Public and Private Sector Business Opportunities for 200+ Countries |
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| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Advanced Technology/Materials Composites R & D Machinery Industrial Technology ／Manufacturing Technology & Engineering | |||
| Start Date | 11.06.2024 | |||
| End Date | 13.06.2024 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. | |||
| For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | JIEP Tel : +81-3-5310-2020 E-mail : show@jpca.org | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | 2024 Microelectronics Show June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP Tel : +81-3-5310-2020 E-mail : show@jpca.org For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
Japan
| Title |
|---|
2024 Microelectronics Show |
| Country |
|
Japan
|
| City |
| Tokyo |
| Regions |
| APEC Countries Asia Eastern Asia |
| Industries |
| Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Advanced Technology/Materials Composites R & D Machinery Industrial Technology ／Manufacturing Technology & Engineering |
| Start Date |
| 11.06.2024 |
| End Date |
| 13.06.2024 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. |
| For Visitors |
| Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| JIEP Tel : +81-3-5310-2020 E-mail : show@jpca.org |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| 2024 Microelectronics Show June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP Tel : +81-3-5310-2020 E-mail : show@jpca.org For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Share |
